One production base, one traceable process
A remote buyer cannot walk the line, so we publish what the line actually is: where it sits, what it runs, and the sequence every panel follows.
Mianyang Electronics Manufacturing Base
3F, Zone A, Building B, Phase 2, Nanhu Innovation Park, No. 89 Jiajiadian Street, Economic Development Zone, Mianyang, Sichuan, China
Our single production site sits in the China Electronics Technology City in Mianyang, Sichuan, inside an established electronics manufacturing cluster. Fabrication, lamination, plating, inspection and electrical test all run under one roof, and ERP plus MES track every panel through the line, so a finished board can be traced back to its laminate batch, press cycle and test record.
- Double-sided, multilayer and HDI production
- Special materials including BT and polyimide
- COB and communication module boards
- ERP plus MES lot-level traceability
Equipment and process areas
Selected views from drilling through final electrical test. Click any image to enlarge.
What happens to your panel, stage by stage
Each stage has a defined verification point. Records are kept per lot so a finished board can be traced back to its laminate batch.
- 01
Order & Engineering Review
Gerber data is checked against capability limits. Stack-up, annular ring, drill-to-copper and impedance targets are confirmed or raised as an EQ before release.
- 02
Material Cutting & Drilling
Laminate panels are cut to production size and drilled. Hole position and diameter are verified on the first panel of each lot.
- 03
Desmear & Electroless Copper
Hole walls are desmeared and seeded with electroless copper so subsequent plating bonds reliably to the dielectric.
- 04
Pattern Plating & Etching
Copper is plated to final thickness in the hole and on the pattern, then unprotected copper is etched away. Trace width is measured after etch.
- 05
Lamination & Inner-layer AOI
Inner layers are optically inspected before lay-up, then pressed into the multilayer stack. Once laminated, inner layers can no longer be reworked.
- 06
Solder Mask & Surface Finish
Mask is printed and cured, legends are applied, then the selected surface finish is deposited on exposed copper pads.
- 07
Routing & Electrical Test
Boards are routed to final outline and every board is electrically tested for opens, shorts and netlist correctness.
- 08
Final QC & Packing
Dimensional, cosmetic and workmanship checks are completed to IPC-A-600, then boards are vacuum packed with desiccant and shipped.
Visiting or auditing the factory
Customers and third-party auditors are welcome at the Mianyang base with advance notice. If travel is not practical, we arrange a live video walkthrough of the line running your order, and ship inspection records with every lot.
Chengdu Sales Office: No. 603, Floor 6, Building 2, No. 277 Shengyuan Street, Chengdu High-Tech Industrial Development Zone, China (Sichuan) Pilot Free Trade Zone, Chengdu, Sichuan, China · Mianyang Electronics Manufacturing Base: 3F, Zone A, Building B, Phase 2, Nanhu Innovation Park, No. 89 Jiajiadian Street, Economic Development Zone, Mianyang, Sichuan, China
Want to see your own order on the line?
Tell us your project and we will assign the base, process route and inspection plan before you commit.